In recent years, the minimization of electronic components, as well as the higher performance of these components, has resulted in the production of compact parts. Therefore, inactive thermal management systems have been widely considered for electronic devices such as mobile phones. In the present study, two types of phase change materials, Heptadecane and Ecosane have been used to design a thermal management model for an electronic component. In order to optimize the model of thermal management of the electronic component, the parameters of the phase change material type, the thickness of the phase change material, the effect of adding the fin on the phase change material side, and also the effect of thermal flux have been investigated. The results show that the Ecosane has a better effect on the temperature control of the electronic component than Heptadecane. Also, by increasing the thickness of the Ecosane phase change material from 1.65 to 2.5 mm, the average temperature of the electronic component decreases by 3.7° C after 30 minutes. Additionally, the addition of a fin at the phase change material side reduces the temperature of the electronic component and increases the thickness of the fin from 2 to 3 mm, increases the temperature of the electronic component. By changing the thermal flux from 3 W to 2 W, the Ecosane phase change material was completely melting after 13.3 minutes later, which resulted in the average temperature of the component after 90 minutes, 6.5 ˚C decrease compared to the thermal flux 3 W.
